6th International Symposium for Optical Interconnect in Data Centres


Date & Time: Wednesday 26 September, 9:00 – 17:00

Room: Iustina


Tolga Tekin Fraunhofer IZM, Germany

Nikos Pleros AUTH, Greece

Richard Pitwon Resolute Photonics, United Kingdom

Dimitris Apostolopoulos ICCS/NTUA, Greece

Paraskevas Bakopoulos MELLANOX, Israel


The focus of this symposium is the evolution of high-performance, low-energy and low-cost optical and photonic interconnect technologies for data communications. We intend to draw out and discuss the key technology enablers and inhibitors to widespread commercial proliferation of photonic interconnect in mega data centre environments and throughout the wider Internet of Things (IoT) all the way to the “Edge”, and how the optical interconnect community can collectively help to address these.

This technology evolution is already strongly reflected in the research, development and strategic activities of mainstream organisations in the data centre and broader IoT space and the emergence of a new technology eco-system.

The topics addressed will include passive and active embedded optical and photonic interconnect technologies for data centre and IoT including photonic integrated circuits (III-Vs, silicon, polymer, photonic crystals, plasmonics), optical circuit boards, optical transceivers and switches, sensors and the advanced data centre architectures, which these technologies enable.


08:30   Registration

Session 1: Enhanced Data Centre Architectures

09:00   Plenary Talk

09:15   Una Buckley, Dell
Title: “Dell EMC Perspectives: Optical Connectivity for Enterprise Data Centres”

09:30   Bert Offrein and Folkert Horst, IBM Zurich
Title: “Neuromorphic Systems and Photonic”

09:45   Kobi Hasharoni, Dust Photonics
Title: “Chip I/O Disaggregation: Co-packaging a two-dimensional SiP Optical Interconnect with a Switch ASIC”

10:00   Marco Fiorentino, HP Labs
Title: “DWDM silicon photonics for exascale applications”

10:15   Hitesh Ballani, Microsoft UK
Title: “Optics for the Cloud: Opportunities and Challenges”


10:30 – 11:00  Coffee break

Session 2: Advances in Chip Level Integrated Optics and Photonics

11:00   Mark T. Wade, Ayar Labs
Title: “Monolithically Integrated Electronics-Photonics”

11:15   Kazuhiko Kurata, PETRA / AICore
Title: “Multimode commercial PIC transceivers”

11:30   Ronald Broeke, Bright Photonics
Title: “PIC design innovation with Nazca.”

11:45   Clint Schow, UCSB
Title: “Ultra-low power short-reach interconnects for 100G and beyond”

12:00   Shinji Matsuo, NTT
Title: “Membrane lasers and photonic crystal lasers on Si substrate for datacom and computercom applications”

12:15   Bogdan Sirbu, Fraunhofer IZM
Title: “L3MATRIX – Large Scale Silicon Photonics Matrix for Low Power and Low Cost Data Centers”


12:30 -13:30   Lunch break


Session 3: Advances in Board level Integrated Optics and Photonics

13:30   Hideyuki Nawata, Nissan Chemicals
Title: “Advanced polymer materials for PIC interconnect”

13:45   Marika Immonen, TTM Technologies
Title: “Embedded optical PCBs and substrates for PIC applications”

14:00   Jean-Marc Boucaud, STMicroelectronics
Title: “Electrical and Optical Glass Interposer for the Packaging of Silicon Photonics Transceivers”

14:15   Takaaki Ishigure, Keio University
Title: “Polymer Waveguide Enabling High-Density Board-Level and On-Chip Optical Wiring”

14:30   Hideyuki Nasu, Furukawa
Title: “1.3-Tb/s VCSEL-based On-Board Transceiver Module for High-Density Optical Interconnects”

14:45   Segolene Olivier, CEA-LETI
Title: “COSMICC – CmOs Solutions for Mid-board Integrated transceivers with breakthrough Connectivity at ultra-low Cost”


15:00 – 15:30  Coffee break


Session 4: The Blue Sky

15:30   Theoni Alexoudi, Aristotle Univ. Thessaloniki
Title: “ICT-STREAMS – Silicon Photonics Transceiver and Routing technologies for High-End Multi-Socket Server Blades with Tb/s Throughput interconnect interfaces”

15:45   Elad Mentovich, , Mellanox Technologies Ltd.
Title: “plaCMOS – Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers”

16:00   Marco Romagnoli, CNIT
Title: “TeraBOARD – High density scalable optically interconnected Tb/s Board”

16:15   Kostas Vyrsokinos, Aristotle Univ. Thessaloniki
Title: “MOICANA – Monolithic cointegration of QD-based InP on SiN as a versatile platform for the demonstration of high performance and low cost PIC transmitters”

16:30   Pierpaolo Boffi, Politecnico di Milano
Title: “PASSION – Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks”

16:45   Rafael Jordan, Fraunhofer IZM
Title: “European Photonic Innovation Hub for Optical Interconnects – PHOXLAB”


Sponsors for Symposium:

H2020-L3MATRIX and H2020-ICT-STREAMS and H2020-COSMICC and H2020-PASSION and H2020-TERABOARD projects are supporting and sponsoring the 6th International Symposium for Optical Interconnect in Data Centres.